3D failure analysis in depth profiles of sequentially made FIB cuts. - C. N. Mc Auley; Andreas Rummel; F. W. Keating; Stephan Kleindiek (Microelectron. Reliab., 2007)

A new approach for making electrically conductive interconnections between small contacts in failure analysis. - Andreas Rummel; Klaus Schock; Andrew Smith; Stephan Kleindiek (Microelectron. Reliab., 2012)

Repairing bonding wire connections using a microsoldering unit inside an SEM. - Andreas Rummel; Klaus Schock; Matthias Kemmler; Andrew Smith; Stephan Kleindiek (Microelectron. Reliab., 2013)

Current imaging, EBIC/EBAC, and electrical probing combined for fast and reliable in situ electrical fault isolation. - Stephan Kleindiek; Klaus Schock; Andreas Rummel; Michael Zschornack; Pascal Limbecker; Andreas Meyer 006; Matthias Kemmler (Microelectron. Reliab., 2016)