Influence of the turn-on mechanism on TRIACs' reliability: di/dt thermal fatigue study in Q1 compared to Q2. - Stéphane Moreau; Stéphane Forster; Thierry Lequeu; Robert Jérisian (Microelectron. Reliab., 2002)

Comparative study of thermal cycling and thermal shocks tests on electronic components reliability. - Stéphane Moreau; Thierry Lequeu; Robert Jérisian (Microelectron. Reliab., 2004)

MetaSurv: Web-Platform Generator for the Monitoring of Health Indicators and Interactive Geographical Information System. - Laurent Toubiana; Stéphane Moreau; Gaétan Bonnard (MIE, 2005)

200°C direct bonding copper interconnects : Electrical results and reliability. - Léa Di Cioccio; Rachid Taibi; Cédrick Chappaz; Stéphane Moreau; Laurent-Luc Chapelon; Thomas Signamarcheix (3DIC, 2011)

Chip to wafer copper direct bonding electrical characterization and thermal cycling. - Yann Beilliard; Perceval Coudrain; Léa Di Cioccio; Stéphane Moreau; Loic Sanchez; Brigitte Montmayeul; Thomas Signamarcheix; Rafael Estevez; Guillaume Parry (3DIC, 2013)

A new experimental methodology using point deflection to quantify residual stress of thin polymer membrane materials in MEMS devices. - Sofiane Soulimane; Arnaud Pouydebasque; Sébastien Bolis; Fabrice Jacquet; Claudine Bridoux; Florian Dupont; Christophe Poulain; Stéphane Moreau; Stephane Fanget (NEMS, 2013)

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. - Thomas Frank; Stéphane Moreau; Cédrick Chappaz; Patrick Leduc; Lucile Arnaud; Aurélie Thuaire; Emmanuel Chery; F. Lorut; Lorena Anghel; Gilles Poupon (Microelectron. Reliab., 2013)

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding. - Yann Beilliard; Stéphane Moreau; Léa Di Cioccio; Perceval Coudrain; G. Romano; A. Nowodzinski; F. Aussenac; P.-H. Jouneau; E. Rolland; Thomas Signamarcheix (3DIC, 2014)

An overset grid method for large eddy simulation of turbomachinery stages. - Gaofeng Wang; Florent Duchaine; Dimitrios Papadogiannis; Ignacio Duran; Stéphane Moreau; Laurent Y. M. Gicquel (J. Comput. Phys., 2014)

Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence. - Simon Gousseau; Stéphane Moreau; David Bouchu; Alexis Farcy; Pierre Montmitonnet; Karim Inal; François Bay; Marc Zelsmann; Emmanuel Picard; Mathieu Salaün (Microelectron. Reliab., 2015)

Spectral recycling strategies for the solution of nonlinear eigenproblems in thermoacoustics. - Pablo Salas; Luc Giraud; Yousef Saad; Stéphane Moreau (Numer. Linear Algebra Appl., 2015)

ITAC: A complete 3D integration test platform. - Didier Lattard; Lucile Arnaud; Arnaud Garnier; Nicolas Bresson; Franck Bana; R. Segaud; Amadine Jouve; H. Jacquinot; Stéphane Moreau; Karim Azizi-Mourier; C. Chantre; Pascal Vivet; et al. (3DIC, 2016)

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. - Lucile Arnaud; Stéphane Moreau; Amadine Jouve; Imed Jani; Didier Lattard; F. Fournel; C. Euvrard; Y. Exbrayat; Viorel Balan; Nicolas Bresson; S. Lhostis; J. Jourdon; et al. (IRPS, 2018)

Numerical analysis of a high-order unstructured overset grid method for compressible LES of turbomachinery. - J. de Laborderie; Florent Duchaine; Laurent Gicquel; Olivier Vermorel; Gaofeng Wang; Stéphane Moreau (J. Comput. Phys., 2018)

3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. - Christophe Dubarry; Lucile Arnaud; Maria-Luisa Calvo-Muñoz; Gaëlle Mauguen; Stéphane Moreau; R. Crochemore; Nicolas Bresson; Bernard Aventurier (3DIC, 2021)

Effects of Boundary Conditions in Fully Convolutional Networks for Learning Spatio-Temporal Dynamics. - Antonio Alguacil; Wagner Gonçalves Pinto; Michael Bauerheim; Marc C. Jacob; Stéphane Moreau (ECML/PKDD (5), 2021)

New Method to Perform TDDB Tests for Hybrid Bonding Interconnects. - Bassel Ayoub; Stéphane Moreau; S. Lhostis; P. Lamontagne; H. Combeau; J. G. Mattei; Hélène Frémont (IRPS, 2022)

Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits. - Stéphane Moreau; David Bouchu; J. Jourdon; Bassel Ayoub; S. Lhostis; Hélène Frémont; P. Lamontagne (IRPS, 2023)

Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution. - Armen Kteyan; Valeriy Sukharev; Alexander Volkov; Jun-Ho Choy; Farid N. Najm; Yong Hyeon Yi; Chris H. Kim; Stéphane Moreau (ISPD, 2023)

Electromigration Test Chip Experiments from Realistic Power Grid Structures: Failure Trend Comparison and Statistical Analysis. - Yong Hyeon Yi; Chris H. Kim; Armen Kteyan; Alexander Volkov; Stéphane Moreau; Valeriy Sukharev (IRPS, 2024)

Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects. - Jun-Ho Choy; Stéphane Moreau; Catherine Brunet-Manquat; Valeriy Sukharev; Armen Kteyan (ISPD, 2024)

Numerical and Thermal Analysis of Reverse Leakage Current of Pseudo-Vertical GaN p-n Diodes Grown with Selective Area Growth. - Mohammed El Amrani; Thomas Kaltsounis; David Plaza Arguello; Stéphane Moreau; Hala El Rammouz; Matthew Charles; Julien Buckley; Daniel Alquier (IRPS, 2025)

Electromigration Assessment in Power Grids with Account of Non-Uniform Temperature Distribution. - Armen Kteyan; J. Choy; Valeriy Sukharev; Stéphane Moreau; Y. Yi; R. Bloom; C. Kim (IRPS, 2025)

Do you understand epistemic uncertainty? Think again! Rigorous frequentist epistemic uncertainty estimation in regression. - Enrico Foglia; Benjamin Bobbia; Nikita Durasov; Michael Bauerheim; Pascal Fua; Stéphane Moreau; Thierry Jardin (CoRR, 2025)