Experimental characterization of coaxial through silicon vias for 3D integration. - Stephen Adamshick; Douglas Coolbaugh; Michael Liehr (Microelectron. J., 2015)

Antenna on chip design utilizing 3D integration for mixed signal applications. - Stephen Adamshick; Alexander Johnson; K. Moriarty; W. Tremblay; J. Burke (MWSCAS, 2017)

A Novel Low Loss 3D System-in-Package Approach for 60GHz Antenna on Chip Applications. - Stephen Adamshick; Sandhiya Reddy Govindarajulu; Elias A. Alwan (MWSCAS, 2020)