4 Gbps high-density AC coupled interconnection. - Stephen E. Mick; John M. Wilson 002; Paul D. Franzon (CICC, 2002)

Demystifying 3D ICs: The Pros and Cons of Going Vertical. - W. Rhett Davis; John M. Wilson 002; Stephen E. Mick; Jian Xu; Hao Hua; Christopher Mineo; Ambarish M. Sule; Michael B. Steer; Paul D. Franzon (IEEE Des. Test Comput., 2005)

A 36Gb/s ACCI Multi-Channel Bus using a Fully Differential Pulse Receiver. - Lei Luo 006; John M. Wilson 002; Stephen E. Mick; Jian Xu; Liang Zhang 038; Evan Erickson; Paul D. Franzon (CICC, 2006)

3 gb/s AC coupled chip-to-chip communication using a low swing pulse receiver. - Lei Luo 006; John M. Wilson 002; Stephen E. Mick; Jian Xu; Liang Zhang 038; Paul D. Franzon (IEEE J. Solid State Circuits, 2006)