3D-IC dynamic thermal analysis with hierarchical and configurable chip thermal model. - Stephen H. Pan; Norman Chang; Tadaaki Hitomi (3DIC, 2013)

Emerging ADAS Thermal Reliability Needs and Solutions. - Norman Chang; Stephen H. Pan; Karthik Srinivasan; Zhigang Feng; Wenbo Xia; Tim Pawlak; David Geb (IEEE Micro, 2018)

ML-augmented Methodology for Fast Thermal Side-channel Emission Analysis. - Norman Chang; Deqi Zhu; Lang Lin; Dinesh Selvakumaran; Jimin Wen; Stephen H. Pan; Wenbo Xia; Hua Chen; Calvin Chow; Gary Chen (ASP-DAC, 2021)

ML-based Fast On-Chip Transient Thermal Simulation for Heterogeneous 2.5D/3D IC Designs. - Akhilesh Kumar; Norman Chang; David Geb; Haiyang He; Stephen H. Pan; Jimin Wen; Saeed Asgari; Mehdi Abarham; Chris Ortiz (VLSI-DAT, 2022)