Measurements and modeling of CDMA PCS in-building systems with distributed antenna. - Howard H. Xia; Angel B. Herrera; Steve Kim; Fernando S. Rico; Brent Bettencourt (VTC, 1994)

A CDMA-distributed antenna system for in-building personal communications services. - Howard H. Xia; Angel B. Herrera; Steve Kim; Fernando S. Rico (IEEE J. Sel. Areas Commun., 1996)

A correlation method for handling infrequent data in keystroke biometric systems. - Steve Kim; Sung-Hyuk Cha; John V. Monaco; Charles C. Tappert (IWBF, 2014)

Malicious Firmware Detection with Hardware Performance Counters. - Xueyang Wang; Charalambos Konstantinou; Michail Maniatakos; Ramesh Karri; Serena Lee; Patricia Robison; Paul Stergiou; Steve Kim (IEEE Trans. Multi Scale Comput. Syst., 2016)

Demo hour. - Xuan Luo; Jason Lawrence; Steven M. Seitz; Anne-Claire Bourland; Peter Gorman; Jess McIntosh; Asier Marzo; Cheng-Te Chi; Ian Gonsher; Steve Kim; McKenna Cisler; Jonathan Lister; et al. (Interactions, 2018)

Power Efficient Video Super-Resolution on Mobile NPUs with Deep Learning, Mobile AI & AIM 2022 Challenge: Report. - Andrey Ignatov; Radu Timofte; Cheng-Ming Chiang; Hsien-Kai Kuo; Yu-Syuan Xu; Man-Yu Lee; Allen Lu; Chia-Ming Cheng; Chih-Cheng Chen; Jia-Ying Yong; Hong-Han Shuai; Wen-Huang Cheng; et al. (ECCV Workshops (3), 2022)

Efficient and Accurate Quantized Image Super-Resolution on Mobile NPUs, Mobile AI & AIM 2022 Challenge: Report. - Andrey Ignatov; Radu Timofte; Maurizio Denna; Abdel Younes; Ganzorig Gankhuyag; Jingang Huh; Myeong Kyun Kim; Kihwan Yoon; Hyeon-Cheol Moon; Seungho Lee; Yoonsik Choe; Jinwoo Jeong; et al. (ECCV Workshops (3), 2022)

A 1-Tb 4b/Cell 4-Plane 162-Layer 3D Flash Memory With a 2.4-Gb/s I/O Speed Interface. - Jong Yuh; Jason Li 001; Heguang Li; Yoshihiro Oyama; Cynthia Hsu; Pradeep Anantula; Stanley Jeong; Anirudh Amarnath; Siddhesh Darne; Sneha Bhatia; Tianyu Tang; Aditya Arya; et al. (ISSCC, 2022)

Efficient and Accurate Quantized Image Super-Resolution on Mobile NPUs, Mobile AI & AIM 2022 challenge: Report. - Andrey Ignatov; Radu Timofte; Maurizio Denna; Abdel Younes; Ganzorig Gankhuyag; Jingang Huh; Myeong Kyun Kim; Kihwan Yoon; Hyeon-Cheol Moon; Seungho Lee; Yoonsik Choe; Jinwoo Jeong; et al. (CoRR, 2022)

A 1-Tb 4-b/cell 4-Plane 162-Layer 3-D Flash Memory With 2.4-Gb/s IO Interface. - Jonghak Yuh; Yen-Lung Jason Li; Heguang Li; Yoshihiro Oyama; Cynthia Hsu; Pradeep Anantula; Gwang Yeong Stanley Jeong; Anirudh Amarnath; Siddhesh Darne; Sneha Bhatia; Tianyu Tang; Aditya Arya; et al. (IEEE J. Solid State Circuits, 2023)