Rotary traveling-wave oscillator arrays: a new clock technology. - John Wood; Terence C. Edwards; Steve Lipa (IEEE J. Solid State Circuits, 2001)

Design and CAD for 3D integrated circuits. - Paul D. Franzon; W. Rhett Davis; Michael B. Steer; Steve Lipa; Eun Chu Oh; Thorlindur Thorolfsson; Samson Melamed; Sonali Luniya; Tad Doxsee; Stephen Berkeley; Ben Shani; Kurt Obermiller (DAC, 2008)

The NCSU Tezzaron design kit. - Steve Lipa; Thorlindur Thorolfsson; Paul D. Franzon (3DIC, 2010)

A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration. - Thorlindur Thorolfsson; Steve Lipa; Paul D. Franzon (CICC, 2012)

Rationale for a 3D heterogeneous multi-core processor. - Eric Rotenberg; Brandon H. Dwiel; Elliott Forbes; Zhenqian Zhang; Randy Widialaksono; Rangeen Basu Roy Chowdhury; Nyunyi M. Tshibangu; Steve Lipa; W. Rhett Davis; Paul D. Franzon (ICCD, 2013)

Exploring early design tradeoffs in 3DIC. - Paul D. Franzon; Shivam Priyadarshi; Steve Lipa; W. Rhett Davis; Thorlindur Thorolfsson (ISCAS, 2013)

3D-enabled customizable embedded computer (3DECC). - Paul D. Franzon; Eric Rotenberg; James Tuck 001; Huiyang Zhou; W. Rhett Davis; Hongwen Dai; Joonmoo Huh; Sungkwan Ku; Steve Lipa; Chao Li 004; Jong Beom Park; Joshua Schabel (3DIC, 2014)

Computing in 3D. - Paul D. Franzon; Eric Rotenberg; James Tuck 001; W. Rhett Davis; Huiyang Zhou; Joshua Schabel; Zhenqian Zhang; J. Brandon Dwiel; Elliott Forbes; Joonmoo Huh; Marcus Tshibangu; Steve Lipa (3DIC, 2015)

Computing in 3D. - Paul D. Franzon; Eric Rotenberg; James Tuck 001; W. Rhett Davis; Huiyang Zhou; Joshua Schabel; Zhenqian Zhang; J. Brandon Dwiel; Elliott Forbes; Joonmoo Huh; Steve Lipa (CICC, 2015)

Under 100-cycle thread migration latency in a single-ISA heterogeneous multi-core processor. - Elliott Forbes; Zhenqian Zhang; Randy Widialaksono; Brandon H. Dwiel; Rangeen Basu Roy Chowdhury; Vinesh Srinivasan; Steve Lipa; Eric Rotenberg; W. Rhett Davis; Paul D. Franzon (Hot Chips Symposium, 2015)

Physical design of a 3D-stacked heterogeneous multi-core processor. - Randy Widialaksono; Rangeen Basu Roy Chowdhury; Zhenqian Zhang; Joshua Schabel; Steve Lipa; Eric Rotenberg; W. Rhett Davis; Paul D. Franzon (3DIC, 2016)

H3 (Heterogeneity in 3D): A Logic-on-Logic 3D-Stacked Heterogeneous Multi-Core Processor. - Vinesh Srinivasan; Rangeen Basu Roy Chowdhury; Elliott Forbes; Randy Widialaksono; Zhenqian Zhang; Joshua Schabel; Sungkwan Ku; Steve Lipa; Eric Rotenberg; W. Rhett Davis; Paul D. Franzon (ICCD, 2017)

Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages. - T. Robert Harris; W. Rhett Davis; Steven Lipa; W. Shepherd Pitts; Paul D. Franzon (3DIC, 2019)

Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning. - Theodros Nigussie; Joshua Schabel; Steve Lipa; Lisa G. McIlrath; Robert Patti; Paul D. Franzon (IEEE Trans. Very Large Scale Integr. Syst., 2022)