Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology. - John U. Knickerbocker; Chirag S. Patel; Paul S. Andry; Cornelia K. Tsang; L. Paivikki Buchwalter; Edmund J. Sprogis; Hua Gan; Raymond R. Horton; Robert J. Polastre; Steven L. Wright; Christian D. Schuster; Christian W. Baks; et al. (CICC, 2005)