Crystal size and direction dependence of the elastic properties of Cu3Sn through molecular dynamics simulation and nanoindentation testing. - Wen-Hwa Chen; Ching-Feng Yu; Hsien-Chie Cheng; Su-Tsai Lu (Microelectron. Reliab., 2012)

IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging. - Wen-Hwa Chen; Ching-Feng Yu; Hsien-Chie Cheng; Yu-min Tsai; Su-Tsai Lu (Microelectron. Reliab., 2013)