Coupling Noise Mitigation using a Pass Transistor. - Selahattin Sayil; Subed Lamichhane; Kutay Sayil (ISVLSI, 2020)

Fast Electrostatic Analysis For VLSI Aging based on Generative Learning. - Subed Lamichhane; Shaoyi Peng; Wentian Jin; Sheldon X.-D. Tan (MLCAD, 2021)

HierPINN-EM: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnects Using Hierarchical Physics-Informed Neural Network. - Wentian Jin; Liang Chen 025; Subed Lamichhane; Mohammadamir Kavousi; Sheldon X.-D. Tan (ICCAD, 2022)

PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks. - Subed Lamichhane; Wentian Jin; Liang Chen 025; Mohammadamir Kavousi; Sheldon X.-D. Tan (ICCAD, 2023)

Linear Time Electromigration Analysis Based on Physics-Informed Sparse Regression. - Liang Chen 025; Wentian Jin; Mohammadamir Kavousi; Subed Lamichhane; Sheldon X.-D. Tan (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2023)

BPINN-EM: Fast Stochastic Analysis of Electromigration Damage using Bayesian Physics-Informed Neural Networks. - Subed Lamichhane; Mohammadamir Kavousi; Sheldon X.-D. Tan (ICCAD, 2024)

EMspice 2.0: Multiphysics Electromigration Analysis Tool for Beyond Moore ICs. - Subed Lamichhane; Mohammadamir Kavousi; Sheldon X.-D. Tan (ISVLSI, 2024)

EMSpice 2.1: A Coupled EM and IR Drop Analysis Tool with Joule Heating and Thermal Mapb Integration for VLSI Reliability. - Subed Lamichhane; Haotian Lu 002; Sheldon X.-D. Tan (SMACD, 2025)

BPINN-EM-Post: Stochastic Electromigration Damage Analysis in the Post-Void Phase based on Bayesian Physics-Informed Neural Network. - Subed Lamichhane; Haotian Lu 002; Sheldon X.-D. Tan (CoRR, 2025)

EMSpice 2.1: A Coupled EM and IR Drop Analysis Tool with Joule Heating and Thermal Map Integration for VLSI Reliability. - Subed Lamichhane; Haotian Lu 002; Sheldon X.-D. Tan (CoRR, 2025)