Analysis of indentation measured mechanical properties on Multilayer Ceramic Capacitors (MLCCs). - Nga Man Li; Subramani Manoharan; Diganta Das; F. Patrick McCluskey (Microelectron. Reliab., 2018)

Mechanism of wire bond shear testing. - Subramani Manoharan; Chandradip Patel; Stevan Hunter; F. Patrick McCluskey (Microelectron. Reliab., 2018)

Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment. - Subramani Manoharan; Chandradip Patel; F. Patrick McCluskey; Michael G. Pecht (Microelectron. Reliab., 2018)