Fast & Accurate Methodology for Aging Incorporation in Circuits using Adaptive Waveform Splitting (AWS). - Subrat Mishra; Pieter Weckx; Ji-Yung Lin; Ben Kaczer; Dimitri Linten; Alessio Spessot; Francky Catthoor (IRPS, 2020)

Overhead Reduction with Optimal Margining Using A Reliability Aware Design Paradigm. - Subrat Mishra; Pieter Weckx; Odysseas Zografos; Ji-Yung Lin; Alessio Spessot; Francky Catthoor (IRPS, 2021)

Proactive Run-Time Mitigation for Time-Critical Applications Using Dynamic Scenario Methodology. - Ji-Yung Lin; Pieter Weckx; Subrat Mishra; Alessio Spessot; Francky Catthoor (DATE, 2022)

Multitimescale Mitigation for Performance Variability Improvement in Time-Critical Systems. - Ji-Yung Lin; Pieter Weckx; Subrat Mishra; Alessio Spessot; Francky Catthoor (IEEE Trans. Very Large Scale Integr. Syst., 2022)

Thermal Performance Analysis of Mempool RISC-V Multicore SoC. - Sankatali Venkateswarlu; Subrat Mishra; Herman Oprins; Bjorn Vermeersch; Moritz Brunion; Jun-Han Han; Mircea R. Stan; Pieter Weckx; Francky Catthoor (IEEE Trans. Very Large Scale Integr. Syst., 2022)

Electromigration-aware design technology co-optimization for SRAM in advanced technology nodes. - Mahta Mayahinia; Hsiao-Hsuan Liu; Subrat Mishra; Zsolt Tokei; Francky Catthoor; Mehdi B. Tahoori (DATE, 2023)

Learning-Oriented Reliability Improvement of Computing Systems From Transistor to Application Level. - Behnaz Ranjbar; Florian Klemme; Paul R. Genssler; Hussam Amrouch; Jinhyo Jung; Shail Dave; Hwisoo So; Kyongwoo Lee; Aviral Shrivastava; Ji-Yung Lin; Pieter Weckx; Subrat Mishra; et al. (DATE, 2023)

Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs). - Subrat Mishra; Sankatali Venkateswarlu; Bjorn Vermeersch; Moritz Brunion; Melina Lofrano; Dawit Burusie Abdi; Herman Oprins; Dwaipayan Biswas; Odysseas Zografos; Gaspard Hiblot; Geert Van der Plas; Pieter Weckx; et al. (IRPS, 2023)

Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC. - Sankatali Venkateswarlu; Subrat Mishra; Herman Oprins; Bjorn Vermeersch; Moritz Brunion; Jun-Han Han; Mircea R. Stan; Dwaipayan Biswas; Pieter Weckx; Francky Catthoor (IEEE Trans. Very Large Scale Integr. Syst., 2023)

Thermal Analysis of High-Performance Server SoCs from FinFET to Nanosheet Technologies. - Nitish Kumar; Sankatali Venkateswarlu; Yukai Chen; Moritz Brunion; Subrat Mishra; Ankur Gupta; Pushpapraj Singh; Francky Catthoor; James Myers; Julien Ryckaert; Dwaipayan Biswas (IRPS, 2024)

Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation. - Subrat Mishra; Bjorn Vermeersch; Sankatali Venkateswarlu; Halil Kukner; A. Sharma; G. Mirabeli; Fabian M. Bufler; Moritz Brunion; Dawit Burusie Abdi; Herman Oprins; Dwaipayan Biswas; Odysseas Zografos; et al. (IRPS, 2024)

Possible Origins, Identification, and Screening of Silent Data Corruption in Data Centers. - Dishant Sangani; Ben Kaczer; Pieter Weckx; Philippe J. Roussel; Subrat Mishra; Erik Jan Marinissen; Georges G. E. Gielen (IRPS, 2024)

Thermal Implications in Scaling High-Performance Server 3D Chiplet-Based 2.5D SoC from FinFET to Nanosheet. - Yukai Chen; Sankatali Venkateswarlu; Subrat Mishra; Julien Ryckaert; James Myers; Dwaipayan Biswas (ISVLSI, 2024)

Late Breaking Results: Thermal Feasibility of Backside Integrated LDOs in 2.5D/3D System-in-Package Using Nanosheet Technology. - Yukai Chen; Subrat Mishra; Julien Ryckaert; Dwaipayan Biswas; James Myers (DATE, 2025)