SHINSAI: A 586 mm2 Reusable Active TSV Interposer With Programmable Interconnect Fabric and 512 Mb Underdeck Memory. - Haozhe Zhu; Bo Jiao 003; Yuman Zeng; Yongjiang Li; Jie Liao; Siyao Jia; Zexing Chen; Liyu Lin; Xuanda Lin; Suchang Huang; Mochen Tian; Jundong Zhu; et al. (IEEE J. Solid State Circuits, 2026)