Traceback Analysis of Unknown Nanoparticles Formation Mechanism on OSP Surface Finished PCB for Flip-Chip Package. - Ha-Yeong Kim; Jiwon Kim; Yeon-Ryong Chu; Suk Jekal; Minki Sa; Chan-Gyo Kim; Gyu-Sik Park; Jisu Lim; Zambaga Otgonbayar; Chang-Min Yoon (IEEE Access, 2024)

A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package. - Jisu Lim; Wonbin Kim; Suk Jekal; Jiwon Kim; Ha-Yeong Kim; Zambaga Otgonbayar; Jeoung Han Kim; Jinsung Rho; Woo-Jin Song; Chang-Min Yoon (IEEE Access, 2025)