Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study. - Woon-Seong Kwon; Suk-Jin Ham; Kyung-Wook Paik (Microelectron. Reliab., 2006)

Forward-stepwise regression analysis for fine leak batch testing of wafer-level hermetic MEMS packages. - Changsoo Jang; Byeng Dong Youn; Ping F. Wang; Bongtae Han; Suk-Jin Ham (Microelectron. Reliab., 2010)