A lightweight implementation of RSVP-TE protocol for MPLS-TE signaling. - Young Woo Lee; Suncheul Kim; Jaehyung Park; Sangha Kim 001 (Comput. Commun., 2007)

Stress Analysis of Tungsten Deposition in a 3D Trench Mold With Regard to Initial Nuclei Shape. - Jong-Sung Lee; Suncheul Kim; Donghoon Han; Myoung-Gyu Lee; Young-Chang Joo (IEEE Access, 2022)