Reduction of defects in TSV filled with Cu by high-speed 3-step PPR for 3D Si chip stacking. - Sung Chul Hong; Wang Gu Lee; Won Joong Kim; Jong Hyeong Kim; Jae Pil Jung (Microelectron. Reliab., 2011)

HOD: A Benchmark Dataset for Harmful Object Detection. - Eungyeom Ha; Heemook Kim; Sung Chul Hong; Dongbin Na (CoRR, 2023)