Quality factor measurement of micro gyroscope structure according to vacuum level and desired Q-factor range package method. - Jong-Seok Kim; Sang-Woo Lee; Kyu-Dong Jung; Woon-Bae Kim; Sung-Hoon Choa; Byeong-Kwon Ju (Microelectron. Reliab., 2008)

Numerical analysis of bonding process-induced deformation for 3D package. - Sung-Hoon Choa; Haeng-Soo Lee; Kyoung-Ho Kim (3DIC, 2011)

Development of Micro-Heaters with Optimized Temperature Compensation Design for Gas Sensors. - Woo-Jin Hwang; Kyu-Sik Shin; Ji-Hyoung Roh; Daesung Lee 001; Sung-Hoon Choa (Sensors, 2011)

Mechanical and environmental durability of roll-to-roll printed silver nanoparticle film using a rapid laser annealing process for flexible electronics. - Min Yang; Min-Woo Chon; Joo-Hyun Kim; Seung-Hyun Lee; Jeongdai Jo; Junyeob Yeo; Seung Hwan Ko; Sung-Hoon Choa (Microelectron. Reliab., 2014)

Electromechanical properties of printed copper ink film using a white flash light annealing process for flexible electronics. - Kyoungtae Eun; Min-Woo Chon; Tae-Hee Yoo; Yong-Won Song; Sung-Hoon Choa (Microelectron. Reliab., 2015)

Electromechanical reliability of a flexible metal-grid transparent electrode prepared by electrohydrodynamic (EHD) jet printing. - Sang Min Yang; Yo Seb Lee; Yonghee Jang; Doyoung Byun; Sung-Hoon Choa (Microelectron. Reliab., 2016)

Wafer-level Packaging Platform for MEMS Sensor Applications. - Taehyun Kim; Junmo Yang; Chungmo Yang; Sung-Hoon Choa; Hee Yeoun Kim (ISOCC, 2024)