Non-contact wafer-level TSV connectivity test methodology using magnetic coupling. - Jonghoon J. Kim; Heegon Kim; Sukjin Kim; Bumhee Bae; Daniel H. Jung; Sunkyu Kong; Joungho Kim; Junho Lee; Kunwoo Park (3DIC, 2013)

Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment. - Bumhee Bae; Sunkyu Kong; Jonghoon J. Kim; Sukjin Kim; Joungho Kim (EMC Compo, 2013)

Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling. - Jonghoon J. Kim; Heegon Kim; Sukjin Kim; Bumhee Bae; Daniel H. Jung; Sunkyu Kong; Joungho Kim; Junho Lee; Kunwoo Park (EMC Compo, 2013)

Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System. - Jiseong Kim; Jonghoon J. Kim; Sunkyu Kong; Hongseok Kim; In-Soo Suh; Nam Pyo Suh; Dong-Ho Cho; Joungho Kim; Seungyoung Ahn (Proc. IEEE, 2013)

Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. - Jonghoon J. Kim; Bumhee Bae; Sukjin Kim; Sunkyu Kong; Heegon Kim; Daniel H. Jung; Joungho Kim (3DIC, 2014)

TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. - Jonghoon J. Kim; Daniel H. Jung; Heegon Kim; Sunkyu Kong; Sumin Choi; Jaemin Lim; Joungho Kim (EMC Compo, 2015)