Interconnect design and analysis for Through Silicon Interposers (TSIs). - Joseph Romen Cubillo; Roshan Weerasekera; Zaw Zaw Oo; En-Xiao Liu; Bob Conn; Surya Bhattacharya; Robert Patti (3DIC, 2011)

Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI). - Guruprasad Katti; S. W. Ho; Li Hong Yu; Songbai Zhang; Rahul Dutta; Roshan Weerasekera; Ka-Fai Chang; Jong-Kai Lin; Srinivasa Rao Vempati; Surya Bhattacharya (IEEE Des. Test, 2015)

NetFlex: A 22nm Multi-Chiplet Perception Accelerator in High-Density Fan-Out Wafer-Level Packaging. - Teyuh Chou; Wei Tang 010; Mihai D. Rotaru; Chester Liu; Rahul Dutta; Sharon Lim Pei Siang; David Ho Soon Wee; Surya Bhattacharya; Zhengya Zhang (VLSI Technology and Circuits, 2022)

Multi-Chiplet Heterogeneous Integration Packaging for Semiconductor System Scaling. - Surya Bhattacharya; Vempati Srinivasa Rao (VLSI Technology and Circuits, 2023)

1.6 Tbps (224 Gbps/λ) Silicon Photonic Engine Fabricated with Advanced Electronic-Photonic FOWLP for Co-Packaged Optics and Linear Drive Applications. - Xin Li; Sajay B. N. Gourikutty; Jiaqi Wu; Teck Guan Lim; Pengfei Guo; Jaye C. Davies; Sing-Chee Koh; Lau Boon Long; Ming Chinq Jong; Chao Li; Guo-Qiang Lo; Surya Bhattacharya; et al. (OFC, 2024)