Electrolessly deposited diffusion barriers for microelectronics. - Eugene J. O'Sullivan; Alejandro G. Schrott; Milan Paunovic; Carlos J. Sambucetti; Jeffrey R. Marino; Philip J. Bailey; Suryanarayana Kaja; Krystyna W. Semkow (IBM J. Res. Dev., 1998)

Metallization by plating for high-performance multichip modules. - Keith K. H. Wong; Suryanarayana Kaja; Patrick W. DeHaven (IBM J. Res. Dev., 1998)