Heat spreading packaging solutions for hybrid bonded 3D-ICs. - Rafael Prieto; Perceval Coudrain; Jean-Philippe Colonna; Y. Hallez; Christian Chancel; Venceslass Rat; Sylvain Dumas; G. Romano; R. Franiatte; C. Brunet-Manquiat; Séverine Cheramy; Alexis Farcy (3DIC, 2016)

Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. - Perceval Coudrain; Papa Momar Souare; Rafael Prieto; Vincent Fiori; Alexis Farcy; Laurent Le Pailleur; Jean-Philippe Colonna; Cristiano Santos; Pascal Vivet; M. Haykel Ben Jamaa; Denis Dutoit; François de Crecy; et al. (IEEE Des. Test, 2016)

Benefits of Design Assist Techniques on Performances and Reliability of a RRAM Macro. - Bastien Giraud; Sebastien Ricavy; Yasser Moursy; Cyrille Laffond; Ilan Sever; Valentin Gherman; Manuel Pezzin; Florent Lepin; Mariam Diallo; Khadija Zenati; Sylvain Dumas; Maxim Vershkov; et al. (IMW, 2023)

Smart Write Algorithm to Enhance Performances and Reliability of an RRAM Macro. - Bastien Giraud; Sebastien Ricavy; Cyrille Laffond; Ilan Sever; Valentin Gherman; Florent Lepin; Mariam Diallo; Khadija Zenati; Sylvain Dumas; Olivier Guille; Maxim Vershkov; Alessandro Bricalli; et al. (IEEE J. Solid State Circuits, 2024)