Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration. - Sylvain Joblot; Alexis Farcy; Nicolas Hotellier; Amadine Jouve; François de Crecy; Arnaud Garnier; M. Argoud; C. Ferrandon; J.-P. Colonna; R. Franiatte; C. Laviron; Séverine Cheramy (3DIC, 2013)

Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer. - Khadim Dieng; Philippe Artillan; Cédric Bermond; Olivier Guiller; Thierry Lacrevaz; Sylvain Joblot; Gregory Houzet; Alexis Farcy; Yann Lamy; Bernard Fléchet (3DIC, 2014)

Effect of Metallic Ion Implantation on Dark Current Distributions of Silicon-Based CMOS Image Sensors. - Juan Esteban Montoya Cardona; Sylvain Joblot; Pierre Kermagoret; Grégoire Ducotey; Stéphane Hardillier; Guillaume Dupeux; Yannick Borde; Jean-Pierre Carrère; Sandrine Lhostis; Richard Monflier; Olivier Marcelot; Vincent Goiffon (IEEE SENSORS, 2024)