EOT Scaling Via 300mm MX2 Dry Transfer - Steps Toward a Manufacturable Process Development and Device Integration. - S. Ghosh; A. Kruv; Quentin Smets; Tom Schram; D. J. Leech; T. Ding; V. Turkani; Benjamin Groven; A. Dangel; G. Probst; Thomas Uhrmann; Markus Wimplinger; et al. (VLSI Technology and Circuits, 2024)