Enhancement of adhesion strength of Cu layer with low dielectric constant SiC: H liners in Cu interconnects. - Grace Wang; S. Balakumar; S. C. Hwee; Rakesh Kumar; T. Hara (Microelectron. J., 2005)

The advanced data searching system with AMGA at the Belle II experiment. - J. H. Kim; S. Ahn; Kihyeon Cho; M. Bracko; Zbynek Drasal; Thomas Fifield; R. Frühwirth; R. Grzymkowski; T. Hara; Martin Heck; S. Hwang; Y. Iida; et al. (Comput. Phys. Commun., 2011)

Dual-camera system for high-speed imaging in particle image velocimetry. - Kosuke Hashimoto; Akihiro Hori; T. Hara; Shigeru Onogi; Hideaki Mouri (J. Vis., 2012)