Properties of solders and their fatigue in power modules. - Guy Lefranc; T. Licht; Gerhard Mitic (Microelectron. Reliab., 2002)

Reliable power electronics for automotive applications. - Norbert Seliger; E. Wolfgang; Guy Lefranc; H. Berg; T. Licht (Microelectron. Reliab., 2002)

High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC. - Gerard Coquery; Guy Lefranc; T. Licht; Richard Lallemand; Norbert Seliger; H. Berg (Microelectron. Reliab., 2003)

A new method to characterize the thermomechanical response of multilayered structures in power electronics. - P. Zimprich; T. Licht; B. Weiss (Microelectron. Reliab., 2006)

A fast mechanical test technique for life time estimation of micro-joints. - Golta Khatibi; W. Wroczewski; Brigitte Weiss; T. Licht (Microelectron. Reliab., 2008)

A fast test technique for life time estimation of ultrasonically welded Cu-Cu interconnects. - Bernhard Czerny; Golta Khatibi; Brigitte Weiss; T. Licht (Microelectron. Reliab., 2010)