Fast dynamic simulation of VLSI circuits using reduced order compact macromodel of standard cells. - Shivam Priyadarshi; Nikhil Kriplani; Michael B. Steer; T. Robert Harris (BMAS, 2010)

Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels. - Shivam Priyadarshi; T. Robert Harris; Samson Melamed; Carlos Tadeo Ortega Otero; Nikhil Kriplani; Carlos E. Christoffersen; Rajit Manohar; Steven R. Dooley; W. Rhett Davis; Paul D. Franzon; Michael B. Steer (IET Circuits Devices Syst., 2012)

Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring. - Samson Melamed; Thorlindur Thorolfsson; T. Robert Harris; Shivam Priyadarshi; Paul D. Franzon; Michael B. Steer; W. Rhett Davis (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012)

Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits. - T. Robert Harris; Paul D. Franzon; W. Rhett Davis; Lee Wang (3DIC, 2014)

Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks. - T. Robert Harris; Eric J. Wyers; Lee Wang; Samuel Graham; Georges Pavlidis; Paul D. Franzon; W. Rhett Davis (3DIC, 2015)

Characterization of the mechanical stress impact on device electrical performance in the CMOS and III-V HEMT/HBT heterogeneous integration environment. - Eric J. Wyers; T. Robert Harris; Wallace Shep Pitts; Jordan E. Massad; Paul D. Franzon (3DIC, 2015)

Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages. - T. Robert Harris; W. Rhett Davis; Steven Lipa; W. Shepherd Pitts; Paul D. Franzon (3DIC, 2019)

Review of Hybrid Integration Techniques for Integrating III-V Onta Silicon. - Erik W. Masselink; Andrew Stark; Benjamin B. Yang; T. Robert Harris (3DIC, 2023)