Superconductive interconnections in multi-chip modules. - Bertrand Cabon; T. V. Dinh; J. Chilo (VLSI, 1993)

Correlation Technologies for OTA Testing of mmWave Mobile Devices Using Energy Metrics. - Sidina Wane; T. V. Dinh; Q. H. Tran; Damienne Bajon; F. Ferrero; Lionel Duvillaret; Gwenaël Gaborit; Jacques Sombrin; E. de Lédinghen; P. Laban; Vincent Huard; Souhir Mhira; et al. (RWS, 2022)

Assessment of the Transient Self-Heating Effect and its Impact on the Performance of Watt-Level RF Power Amplifier in a FinFET Technology. - T. V. Dinh; S.-W. Tam; A. J. Scholten; L. Tondelli; R. M. T. Pijper; S. H. Kondapalli; J. Xie; A. Wong; I. To; R. Asanovski; L. Selmi (VLSI Technology and Circuits, 2024)

Distinct Signatures of Self-Heating and Trap Dynamics on the AC Y-Parameters of Advanced n-MOSFETs. - L. Tondelli; A. J. Scholten; J. Van Beurden; R. M. T. Pijper; R. Asanovski; T. V. Dinh; L. Selmi (IRPS, 2025)