Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces. - H. W. Tseng; C. T. Lu; Y. H. Hsiao; P. L. Liao; Y. C. Chuang; T. Y. Chung; Cheng-Yi Liu (Microelectron. Reliab., 2010)

Development of a Bipedal Hopping Robot With Morphable Inertial Tail for Agile Locomotion. - Jiajun An; T. Y. Chung; Chun Ho David Lo; Carlos Ma; Xiangyu Chu; K. W. Samuel Au (BioRob, 2020)