Overview of Board-Level Solder Joint Reliability Modeling for Single Die and Stacked Die CSPs. - Z. W. Zhong; T. Y. Tee (Proc. IEEE, 2009)

Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP. - Y. A. Su; Long Bin Tan; T. Y. Tee; Vincent B. C. Tan (Microelectron. Reliab., 2010)