Micro-bump assignment for 3D ICs using order relation. - Ta-Yu Kuan; Yi-Chun Chang; Tai-Chen Chen (ASP-DAC, 2012)

Challenges and solutions in modern analog placement. - Tung-Chieh Chen; Ta-Yu Kuan; Chung-Che Hsieh; Chi-Chen Peng (VLSI-DAT, 2012)

Double patterning lithography-aware analog placement. - Hsing-Chih Chang Chien; Hung-Chih Ou; Tung-Chieh Chen; Ta-Yu Kuan; Yao-Wen Chang (DAC, 2013)