Effect of Creep Properties on Pressure Induced Tin Whisker Formation. - Tadahiro Shibutani; Qiang Yu; Masaki Shiratori (SSIRI, 2008)

Key reliability concerns with lead-free connectors. - Tadahiro Shibutani; Ji Wu; Qiang Yu; Michael G. Pecht (Microelectron. Reliab., 2008)

Pressure-induced tin whisker formation. - Tadahiro Shibutani; Qiang Yu; Masaki Shiratori; Michael G. Pecht (Microelectron. Reliab., 2008)

Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints. - Qiang Yu; Tadahiro Shibutani; Do-Seop Kim; Yusuke Kobayashi 004; Jidong Yang; Masaki Shiratori (Microelectron. Reliab., 2008)

Topologically robust B-spline surface reconstruction from point clouds using level set methods and iterative geometric fitting algorithms. - Hiroki Yoshihara; Tatsuya Yoshii; Tadahiro Shibutani; Takashi Maekawa (Comput. Aided Geom. Des., 2012)

Precursor monitoring approach for reliability assessment of cooling fans. - Hyun-Seok Oh; Tadahiro Shibutani; Michael G. Pecht (J. Intell. Manuf., 2012)

IoT-Based Prognostics and Systems Health Management for Industrial Applications. - Daeil Kwon; Melinda R. Hodkiewicz; Jiajie Fan; Tadahiro Shibutani; Michael G. Pecht (IEEE Access, 2016)

Curvature sensitive analysis of axially compressed cylindrical tubes with corrugated surface using isogeometric analysis and experiment. - Takuma Imai; Tadahiro Shibutani; Kazumi Matsui; Seitoku Kumagai; Dang Tien Tran; Kaiyuan Mu; Takashi Maekawa (Comput. Aided Geom. Des., 2016)

A fusion prognostics-based qualification test methodology for microelectronic products. - Michael G. Pecht; Tadahiro Shibutani; Myeongsu Kang; Melinda Hodkiewicz; Edward Cripps (Microelectron. Reliab., 2016)

A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded. - Michael G. Pecht; Tadahiro Shibutani; Lifeng Wu (Microelectron. Reliab., 2016)

Finite element analysis of thermal and mechanical stresses due to the grain anisotropy of polycrystalline β-Sn. - Junji Sakamoto; Hisakazu Ohara; Tadahiro Shibutani (Microelectron. Reliab., 2017)

Nucleation and shrinkage of defects on the surface of tin induced by local strain distribution. - Tadahiro Shibutani; Jing Wen Sun (Microelectron. Reliab., 2017)

Potential failure mode identification of operational amplifier circuit board by using high accelerated limit test. - Junji Sakamoto; Ryoma Hirata; Tadahiro Shibutani (Microelectron. Reliab., 2018)

Fabrication of doubly-curved CFRP shell structures with control over fiber directions. - Masahito Takezawa; Yuto Otoguro; Kohei Matsuo; Tadahiro Shibutani; Akio Sakurai; Takashi Maekawa (Comput. Aided Des., 2021)