High-performance FCBGA based on multi-layer thin-substrate packaging technology. - Tadanori Shimoto; Katsumi Kikuchi; Kazuhiro Baba; Koji Matsui; Hirokazu Honda; Keiichiro Kata (Microelectron. Reliab., 2004)

Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs. - Tadanori Shimoto; Kazuhiro Baba; Koji Matsui; Jun Tsukano; Takehiko Maeda; Kenji Oyachi (Microelectron. Reliab., 2005)