Mechanical properties versus temperature relation of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy. - Feng Gao; Hiroshi Nishikawa; Tadashi Takemoto; Jianmin Qu (Microelectron. Reliab., 2009)

Thin film joining for high-temperature performance of power semi-conductor devices. - Toshihide Takahashi; Shuichi Komatsu; Hiroshi Nishikawa; Tadashi Takemoto (Microelectron. Reliab., 2010)

Explanation of impact load curve in ball impact test in relation to thermal aging. - Tomoya Daito; Hiroshi Nishikawa; Tadashi Takemoto; Takashi Matsunami (Microelectron. Reliab., 2013)