Low-Contact-Force Probing on Copper Electrodes. - Kenichi Kataoka; Toshihiro Itoh; Katsuya Okumura; Tadatomo Suga (ITC, 2002)

Low Contact-Force Fritting Probe Card Using Buckling Microcantilevers. - Kenichi Kataoka; Toshihiro Itoh; Tadatomo Suga (ITC, 2003)

Reliability of Au bump-Cu direct interconnections fabricated by means of surface activated bonding method. - Qian Wang; Naoe Hosoda; Toshihiro Itoh; Tadatomo Suga (Microelectron. Reliab., 2003)

Low-Temperature Au-to-Au Bonding for LiNbO3/Si Structure Achieved in Ambient Air. - Ryo Takigawa; Eiji Higurashi; Tadatomo Suga; Satoshi Shinada; Tetsuya Kawanishi (IEICE Trans. Electron., 2007)

Residue-Free Solder Bumping Using Small AuSn Particles by Hydrogen Radicals. - Eiji Higurashi; Daisuke Chino; Tadatomo Suga (IEICE Trans. Electron., 2009)

Optical Microsensors Integration Technologies for Biomedical Applications. - Eiji Higurashi; Renshi Sawada; Tadatomo Suga (IEICE Trans. Electron., 2009)

Low temperature bonding for 3D interconnects. - Tadatomo Suga; Ryuichi Kondoh (3DIC, 2011)

Nanoadhesion layer for enhanced Si-Si and Si-SiN wafer bonding. - Ryuichi Kondou; Chenxi Wang; Akitsu Shigetou; Tadatomo Suga (Microelectron. Reliab., 2012)

Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging. - Tadatomo Suga; Jenn-Ming Song; Yi-Shao Lai (Microelectron. Reliab., 2012)

Investigation of fluorine containing plasma activation for room-temperature bonding of Si-based materials. - Chenxi Wang; Tadatomo Suga (Microelectron. Reliab., 2012)

Fast atom bombardment onto vertically aligned multi-walled carbon nanotube bumps to achieve low interconnect resistance with Au layer. - Masahisa Fujino; Ikuo Soga; Daiyu Kondo; Yoshikatsu Ishizuki; Taisuke Iwai; Tadatomo Suga (Microelectron. Reliab., 2015)

Room-Temperature Gold-Gold Bonding Method Based on Argon and Hydrogen Gas Mixture Atmospheric-Pressure Plasma Treatment for Optoelectronic Device Integration. - Eiji Higurashi; Michitaka Yamamoto; Takeshi Sato; Tadatomo Suga; Renshi Sawada (IEICE Trans. Electron., 2016)

Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method. - Eiji Higurashi; Ken Okumura; Yutaka Kunimune; Tadatomo Suga; Kei Hagiwara (IEICE Trans. Electron., 2017)

Growth Behavior of Au Films on SiO2 Film and Direct Transfer for Smoothing Au Surfaces. - Michitaka Yamamoto; Takashi Matsumae; Yuichi Kurashima; Hideki Takagi; Tadatomo Suga; Toshihiro Itoh; Eiji Higurashi (Int. J. Autom. Technol., 2019)

Defect evolution in GaN thin film heterogeneously integrated with CMOS-compatible Si(100) substrate by ion-cutting technology. - Hangning Shi; Ailun Yi; Jiaxin Ding; Xudong Liu; Qingcheng Qin; Juemin Yi; Junjie Hu; Miao Wang; Demin Cai; Jianfeng Wang; Ke Xu; Fengwen Mu; et al. (Sci. China Inf. Sci., 2023)