Automatic inspection of solder joints using layered illumination. - Tae-Hyeon Kim 007; Tai-Hoon Cho; Young Shik Moon; Sung-Han Park (ICIP (2), 1996)

An automated visual inspection of solder joints using 2D and 3D features. - Tae-Hyeon Kim 007; Tai-Hoon Cho; Young Shik Moon; Sung-Han Park (WACV, 1996)

Visual inspection system for the classification of solder joints. - Tae-Hyeon Kim 007; Tai-Hoon Cho; Young Shik Moon; Sung-Han Park (Pattern Recognit., 1999)