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Microstructural evaluation and failure analysis of Ag wire bonded to Al pads. - Mi-Ri Choi; Hyung-Giun Kim; Taeg-Woo Lee; Young-Jun Jeon; Yong-Keun Ahn; Kyo-Wang Koo; You-Cheol Jang; So-Yeon Park; Jae-Hak Yee; Nam-Kwon Cho; Il-Tae Kang; Sangshik Kim; et al. (Microelectron. Reliab., 2015)