Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly. - Mohandass Sivakumar; Kripesh Vaidyanathan; Chong Ser Choong; Tai Chong Chai; Loon Aik Lim (Microelectron. Reliab., 2002)

Thermo-mechanical finite element analysis in a multichip build up substrate based package design. - Xiaowu Zhang; Ee-Hua Wong; Charles Lee; Tai Chong Chai; Yiyi Ma; Poi-Siong Teo; D. Pinjala; Srinivasamurthy Sampath (Microelectron. Reliab., 2004)

Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist. - Cher Ming Tan; Kim Peng Lim; Tai Chong Chai; Guat Cheng Lim (Microelectron. Reliab., 2005)

Feasibility study of the application of voltage contrast to printed circuit board. - Cher Ming Tan; Zhenghao Gan; Tai Chong Chai (Microelectron. Reliab., 2006)

Finite element modeling of capacitive coupling voltage contrast. - Cher Ming Tan; Stanny Yanuar; Tai Chong Chai (Microelectron. Reliab., 2007)

Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP). - Xiaowu Zhang; Kripesh Vaidyanathan; Tai Chong Chai; Teck Chun Tan; D. Pinjala (Microelectron. Reliab., 2008)

Electromigration performance of Through Silicon Via (TSV) - A modeling approach. - Yung Chuen Tan; Cher Ming Tan; Xiaowu Zhang; Tai Chong Chai; D. Q. Yu (Microelectron. Reliab., 2010)

Modular sensor chip design for package stress evaluation and reliability characterisation. - A. D. Trigg; Tai Chong Chai; Xiaowu Zhang; Xian Tong Chen; Leong Ching Wai (Microelectron. Reliab., 2012)