3D resistive RAM cell design for high-density storage class memory - a review. - Boris Hudec; Chung-Wei Hsu; I-Ting Wang; Wei-Li Lai; Che-Chia Chang; Taifang Wang; Karol Fröhlich; Chia-Hua Ho; Chen-Hsi Lin; Tuo-Hung Hou (Sci. China Inf. Sci., 2016)