3 Dimensional stacked pixel detector and sensor technology using less than 3-μmφ robust bump junctions. - Makoto Motoyoshi; Kohki Yanagimura; Taikoh Fushimi; Junichi Takanohashi; Mariappan Murugesan; Masahiro Aoyagi; Mitsumasa Koyanagi (3DIC, 2016)

Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction. - Makoto Motoyoshi; Kohki Yanagimura; Taikoh Fushimi; Shunta Endo (3DIC, 2019)