Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration. - Sayuri Kohara; Akihiro Horibe; Kuniaki Sueoka; Keiji Matsumoto; Fumiaki Yamada; Yasumitsu Orii; Katsuyuki Sakuma; Takahiro Kinoshita; Takashi Kawakami (3DIC, 2011)

Heating and Burning of Optical Fibers and Cables by Light Scattered from Bubble Train Formed by Optical Fiber Fuse. - Makoto Yamada; Akisumi Tomoe; Takahiro Kinoshita; Osanori Koyama; Yutaka Katsuyama; Takashi Shibuya 002 (IEICE Trans. Commun., 2012)

Depth estimation from 4D light field videos. - Takahiro Kinoshita; Satoshi Ono (CoRR, 2020)

Escher-like Tiling Design from Video Images Using Convolutional Variational Autoencoder. - Asuka Hisatomi; Tomofumi Matsuyama; Takahiro Kinoshita; Kazunori Mizuno; Satoshi Ono (J. Inf. Sci. Eng., 2021)

Automated Microservice Decomposition Method as Multi-Objective Optimization. - Takahiro Kinoshita; Hideyuki Kanuka (ICSA Companion, 2022)

Enhancing Automated Microservice Decomposition via Multi-Objective Optimization. - Takahiro Kinoshita; Hideyuki Kanuka (IEEE Access, 2024)

HaptoFloater: Visuo-Haptic Augmented Reality by Embedding Imperceptible Color Vibration Signals for Tactile Display Control in a Mid-Air Image. - Rina Nagano; Takahiro Kinoshita; Shingo Hattori; Yuichi Hiroi; Yuta Itoh 001; Takefumi Hiraki (IEEE Trans. Vis. Comput. Graph., 2024)