Automatic 2 1/2 D shape inspection system for via-hole fillings of green sheets by shadow image analysis. - Takanori Ninomiya; Mineo Nomoto; Yasuo Nakagawa (ICRA, 1989)

Precise Position Detection of a Mesh-Backed Printing Screen Based on the Smallest Enclosing Circle Detection. - Takanori Ninomiya; Yasuo Nakagawa (MVA, 1990)

Automated visual inspection for lsi water multilayer patterns by cascade pattern matching algorithm. - Shunji Maeda; Hitoshi Kubota; Hiroshi Makihira; Takanori Ninomiya; Yasuo Nakagawa; Yuzo Taniguchi (Syst. Comput. Jpn., 1990)

Automatic screen-printed circuit pattern inspection using connectivity preserving image reduction and connectivity comparison. - Takanori Ninomiya; Kazushi Yoshimura; Mineo Nomoto; Yasuo Nakagawa (ICPR (1), 1992)

Development of Solder Joint Inspection Method Using Air Stimulation Speckle Vibration Detection Method and Fluorescence Detection Method. - Takashi Hiroi; Kazushi Yoshimura; Takanori Ninomiya; Toshimitsu Hamada; Yasuo Nakagawa; Shigeki Mio; Kouichi Karasaki; Hideaki Sasaki (MVA, 1992)

Automated Inspection System for Electronic Devices Mounted on Printed Circuit Boards Using Light-Section Method. - Toshifumi Honda; Hisae Yamamura; Syouji Ueda; Minoru Kawabata; Takanori Ninomiya (MVA, 1994)

Automated Visual Inspection Algorithm for Solder Joint of Surface Mount Devices Based on Three Dimensional Shape Analysis. - Toshifumi Honda; Yukio Matsuyama; Hisae Yamamura; Hideaki Sasazawa; Takanori Ninomiya; Ludwig Listl; Anton Schick; Richard Schneider (MVA, 1996)

Automated solder joint inspection system using optical 3-D image detection. - Yukio Matsuyama; Toshifumi Honda; Hisae Yamamura; Hideaki Sasazawa; Mineo Nomoto; Takanori Ninomiya; Anton Schick; Ludwig Listl; Paul Köllensperger; Dieter Spriegel; Peter Mengel; Richard Schneider (WACV, 1996)

Automated Visual Inspection for Solder Joints of PCB Based on 3-D Image Analysis. - Toshifumi Honda; Hisae Yamamura; Mineo Nomoto; Takanori Ninomiya; Tomoharu Horii; Yoshio Miyawaki (J. Robotics Mechatronics, 1999)