Development of Solder Joint Inspection Method Using Air Stimulation Speckle Vibration Detection Method and Fluorescence Detection Method. - Takashi Hiroi; Kazushi Yoshimura; Takanori Ninomiya; Toshimitsu Hamada; Yasuo Nakagawa; Shigeki Mio; Kouichi Karasaki; Hideaki Sasaki (MVA, 1992)

Precise visual inspection for LSI wafer patterns using subpixel image alignment. - Takashi Hiroi; Shunji Maeda; Hitoshi Kubota; Kenji Watanabe; Yasuo Nakagawa (WACV, 1994)

Pattern Alignment Method Based on Consistency Among Local Registration Candidates for LSI Wafer Pattern Inspection. - Takashi Hiroi; Chie Shishido; Masahiro Watanabe (WACV, 2002)