Isolation Techniques Against Substrate Noise Coupling Utilizing Through Silicon Via (TSV) Process for RF/Mixed-Signal SoCs. - Shinichiro Uemura; Yukio Hiraoka; Takayuki Kai; Shiro Dosho (IEEE J. Solid State Circuits, 2012)

MARIO: Mid-Air Augmented RealityInteraction with Objects. - Hanyuool Kim; Issei Takahashi; Hiroki Yamamoto; Takayuki Kai; Satoshi Maekawa; Takeshi Naemura (Advances in Computer Entertainment, 2013)