Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration. - Takafumi Fukushima; Takayuki Konno; Eiji Iwata; Risato Kobayashi; Toshiya Kojima; Mariappan Murugesan; Ji Chel Bea; Kang Wook Lee 002; Tetsu Tanaka; Mitsumasa Koyanagi (Micromachines, 2011)

Designing Overseas Fieldwork Using a Mobile Device for Enhancing Students' Reflective Learning. - Makiko Kishi; Takayuki Konno; Masayuki Murakami (ICCE, 2013)