Simple Design Formula for Parallel Plate Mode Suppression by Ground Via-Holes in Multi-Layered Packages. - Takeshi Yuasa; Tamotsu Nishino; Hideyuki Oh-Hashi (IEICE Trans. Electron., 2005)

A Strip Line Broadside Hybrid Coupler Tolerant to Displacement Error and Thickness Variation in Multi-Layered LTCC Substrate. - Takeshi Yuasa; Yukihiro Tahara; Hideyuki Oh-Hashi (IEICE Trans. Electron., 2008)

A Millimeter-Wave Resistance Error Tolerant Termination in Multi-Layered LTCC Substrate. - Takeshi Yuasa; Yukihiro Tahara; Naofumi Yoneda; Hideyuki Oh-Hashi (IEICE Trans. Electron., 2011)

Millimeter-wave transmission line with through-silicon via for RF-MEMS devices. - Shinpei Ogawa; Takeshi Yuasa; Yoshio Fujii; Yukihiro Tahara; Hiroshi Fukumoto (IEICE Electron. Express, 2013)

A PCB Integrated Multi-layered Strip Line Tandem Coupler Using Compensating Ground Through-Hole Elements. - Takeshi Yuasa; Yukihiro Tahara; Tetsu Owada; Naofumi Yoneda; Yoshihiko Konishi; Moriyasu Miyazaki (IEICE Trans. Electron., 2014)

Ka-Band Branch Line Coupler Applied Hexagonal Waveguide Suitable for Additive Manufacturing. - Motomi Abe; Hidenori Yukawa; Yu Ushijima; Takuma Nishimura; Takeshi Oshima; Takeshi Yuasa; Naofumi Yoneda (IEICE Trans. Electron., 2018)

Depth-Aware Dynamic Projection Mapping using High-speed RGB and IR Projectors. - Sora Hisaichi; Kiwamu Sumino; Kunihiro Ueda; Hidenori Kasebe; Tohru Yamashita; Takeshi Yuasa; Uwe Lippmann; Petra Aswendt; Roland Höfling; Yoshihiro Watanabe (SIGGRAPH ASIA Emerging Technologies, 2021)