Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion. - Toshitaka Ishizaki; Daiki Miura; Atsuki Kuno; Ryota Nagao; Syoho Aoki; Yuta Ohshima; Takuma Kino; Masanori Usui; Yasushi Yamada (Microelectron. Reliab., 2016)