New signal skew cancellation method for 2 Gbps transmission in glass and organic interposers to achieve 2.5D package employing next generation high bandwidth memory (HBM). - Shuuichi Kariyazaki; Kenichi Kuboyama; Ryuichi Oikawa; Takuo Funaya (3DIC, 2015)

Electromigration Early Failures for Cu Pillar Interconnections with an ENEPIG Pad Finish and its Suppression. - Hideaki Tsuchiya; Naohito Suzumura; Ryuji Shibata; Hideki Aono; Makoto Ogasawara; Toshihiko Akiba; Kenji Sakata; Kazuyuki Nakagawa; Takuo Funaya (IRPS, 2019)