Decapsulation technique using electrochemical etching for failure analysis of WLCSP n-type Si assembled module devices. - Takuya Naoe; Hirotaka Komoda (Microelectron. Reliab., 2012)

Via high resistance failure analysis of LSI devices induced by multiple factors related to process and design. - Takuya Naoe; Hirotaka Komoda; Tamao Ikeuchi; Kohichi Yokoyama (Microelectron. Reliab., 2012)

Local damage free Si substrate ultra thinning for backside emission spectral analysis using OBPF for LSI failure mode detection. - Takuya Naoe; Tamao Ikeuchi; Chie Moritni; Hirohiko Endoh; Kohichi Yokoyama (Microelectron. Reliab., 2013)

Case studies of defect localization based on software-based fault diagnosis in comparison with PEMS/OBIRCH analysis. - Takuya Naoe; Taketoshi Mizobe; Kohichi Yokoyama (Microelectron. Reliab., 2014)

Copper wire bonding package decapsulation using the anodic protection method. - Hirohiko Endoh; Takuya Naoe (Microelectron. Reliab., 2015)

Case study: Root cause of fluorine detection during TiN ARC layer corrosion of AlSiCu metal lines. - Takuya Naoe (Microelectron. Reliab., 2015)