Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. - K. W. Lee; Chisato Nagai; Ai Nakamura; Ji Chel Bea; Mariappan Murugesan; Takafumi Fukushima; Tanaka Tanaka; Mitsumasa Koyanagi (3DIC, 2014)

Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. - K. W. Lee; Chisato Nagai; Ai Nakamura; Hiroki Aizawa; Ji Chel Bea; Mitsumasa Koyanagi; Hideto Hashiguchi; Takafumi Fukushima; Tanaka Tanaka (3DIC, 2015)

Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications. - Kang Wook Lee 002; Ai Nakamura; Jicheol Bea; Takafumi Fukushima; Suresh Ramalingam; Xin Wu; Tanaka Tanaka; Mitsumasa Koyanagi (3DIC, 2016)